Intel & Micron Sign New 3D XPoint Wafer Supply Agreement
Analysts believe that Intel will now have to pay Micron more than it did previously as it is now only maker of 3D XPoint.
This is a Press Release edited by StorageNewsletter.com on March 17, 2020 at 2:14 pmTo read his article from AnandTech, click on:
Intel & Micron Sign New 3D XPoint Wafer Supply Agreement
Intel and Micron have inked a new 3D XPoint memory wafer supply agreement. Analysts believe that Intel will now have to pay Micron more than it did previously as it is now the only maker of 3D XPoint. The new pact also shows that Intel wants to continue making products based on 3D XPoint, but details about the products remain to be seen.