Toshiba Memory Second-Gen Serial Interface NAND Products

Toshiba Memory Corporation  launched its second-gen line-up of NAND flash memory products for embedded applications with increased performance and capacity ^[1] to support high-speed data transfers.

This serial interface NAND products are compatible with the Serial Peripheral Interface (SPI) and are for a range of consumer, industrial and communication applications.

Sample shipments start with mass production scheduled to begin from October.

With the devices getting smaller in IoT and communication applications, demand for large capacity flash memory in small packages that can handle high-speed data transfers with low pin count is increasing. Due to its compatibility with the SPI, the Serial Interface NAND products can be utilized as SLC NAND flash memory products with a low pin count, small package and large capacity.

In order to support fast data transfers, this second-gen Serial Interface NAND products offer improved performance compared to existing first-gen products^[1], including 133MHz operating frequency and program x4 mode. Furthermore, an 8Gb (1Gb) ^[2] device has been added to the line-up to respond to demands for larger memory capacity.

Outline of new products

Key features

^[1] Compared to Toshiba Memory Corporation’s existing first-gen Serial Interface NAND products. Toshiba Memory survey.
^[2] Product capacity is identified based on the capacity of memory chip(s) within the product, not the amount of memory capacity available for storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application. For details, please refer to applicable product specs.
^[3] WSON: Very-Very thin Small Outline No Lead Package