CompTake Technology Assigned Patent

CompTake Technology Inc., New Taipei, Taiwan, has been assigned a patent (10,383,252) developed by Chen, Wei-Hau, and Chen, Hsin-An, New Taipei, Taiwan, for “solid state disk module and heat sink device thereof.“

The abstract of the patent published by the U.S. Patent and Trademark Office states: ”A heat sink device of solid state disk module includes a heat sink and at least one fixture. The heat sink includes a heat sink body heat conducting with the solid state disk and a pair of sliding slots disposed on the heat sink body. The fixture includes a bottom plate and a pair of side plates. The bottom plate has at least one rib, and the pair of side plates have pressing structures corresponding to the pair of the sliding slots. The pressing structure includes a flap being capable of pressing in the sliding slot and a pull-ab located at a side of the flap. The heat sink body is fixed on the solid state disk through the fixture, and an interval is maintained between the bottom plate and the solid state disk by the at least one rib.”

The patent application was filed on January 11, 2018 (15/867,720).