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FMS: Smart Modular Unveils 3.0-Inch 256GB Gen-Z Memory Module

Uses Gen-Z DRAM memory controller ASSP developed by IntelliProp.

Smart Modular Technologies, Inc., a subsidiary of Smart Global Holdings, Inc., announced a 3.0″ 256GB Gen-Z Memory Module (ZMM) at Gen-Z Consortium booth at FMS.

Smart Modular Gen Z Pressimage

The Gen-Z Consortium is made up of computer industry companies dedicated to creating and commercializing a new data access technology. As a contributing member of the Gen-Z Consortium since 2016, the company has developed and demonstrated multiple generations of Gen-Z memory and storage solutions.

The 3.0″ 256GB DDR4 ZMM supports multiple access semantics, byte and block addressable DRAM access, in-band configuration, and access key/region key memory isolation opcodes. The 3.0″ form factor follows the industry-standard enterprise and datacenter SSD 3-inches form factor from SNIA (4C SFF-TA-1008/9).

The 256GB ZMM supports 30GB/s of data bandwidth with 400ns deterministic access latency running in Hewlett Packard Enterprise and Dell Gen-Z enabled rack servers.

The Gen-Z scalable computing interconnect protocol provides a simplified interface based on memory semantics and is designed to handle workloads, enabling data-centric computing with scalable memory pools and resources for real-time analytics and in-memory applications.

The Gen-Z interconnect standard was developed to enable new solution architectures for delivering performance (high-bandwidth, low-latency), software efficiency, power optimizations, and industry agility.

The firm’s DDR4 256GB ZMM uses a Gen-Z DRAM memory controller ASSP developed by IntelliProp, Inc.

Smart has provided significant development support for Gen-Z adoption,” said Larry Cleland, director, sales and marketing, IntelliProp. “We are glad to be partnered with them for these last few years as we have worked closely together to integrate our Gen-Z Memory Controller ASSPs into their Gen-Z Memory Modules.

Smart’s dedication to the Consortium has been invaluable,” said Kurtis Bowman, president, Gen-Z Consortium. “Solutions like the 256GB Gen-Z Memory Module (ZMM) represent important advancement for the industry ecosystem and encourage the adoption of Gen-Z technology. We look forward to future product developments from Smart and other Consortium members.

The company DDR4 256GB ZMM uses a DDR4 32Gb 3DS 4-high DRAMs provided by Samsung Electronics Co., Ltd.

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