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Micron NAND Automotive-Grade UFS 2.1 to Deliver Cabin Experience in Connected Vehicles

Based on 64-layer TLC NAND, up to 940MB/s and 650MB/s RW, operating temperature from -40°C to 105°C

Micron Technology, Inc. introduced its UFS 2.1 managed NAND products for automotive applications.

Micron Automotive Ufs

This portfolio addresses the need for fast system start-up and higher data bandwidth for in-vehicle infotainment systems and instrument clusters to enhance the driver experience. The company’s UFS 2.1 compliant managed NAND storage solutions deliver fast boot and automotive-grade reliability using cost-effective 64-layer 3D TLC NAND architecture.

Micron Ufs 21 Serial Interface

Next-gen infotainment systems include multiple high-resolution displays as well as AI-enabled human-machine interface functionality such as voice, gesture and image recognition. These feature-rich and performance systems require high-density, high-throughput and low-latency storage. The UFS 2.1 products deliver up to three times the sequential read performance of the company’s e.MMC-based products, bringing instant-on capability and improved responsiveness to create an immersive cabin experience in connected vehicles. (1)

Automotive partners are demanding high-value memory solutions that deliver better performance at affordable price points, in addition to quality, reliability to operate in stringent automotive environments and supply longevity,” said Aravind Ramamoorthy, senior director, NAND solutions, embedded business unit, Micron. “Micron’s UFS 2.1 portfolio based on automotive-grade 64-layer 3D TLC NAND demonstrates our continued commitment to meet the requirements of emerging automotive applications with cost-effective solutions.

Key features of automotive-grade UFS portfolio:

  • Performance: Up to 940MB/s reads and 650MB/s writes, UFS delivers up to 3X faster reads and more than 2X faster writes than e.MMC interfaces (1)

  • Operating temperature: -40°C to 105°C and -40°C to 95°C (2)

  • Quality and reliability: AEC-Q100, IATF 16949-compliant

  • Cost-effectiveness: Based on 64-layer TLC NAND with CMOS under array technology


The company’s UFS managed NAND portfolio of products is sampling to automotive customers, with volume production expected in 3Q19.

These automotive-grade UFS NAND solutions are offered in capacities ranging from 32GB to 256GB.(3)

(1) Sequential writes, nominal temperature and fresh-out-of-box burst performance. May vary based on host and test environments.
(2) Case temperature
(3) 1GB = 1,000,000,000 bytes. Total user accessible capacity varies and may be less.

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