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Silicom Secures Initial Design Win From Unrevealed SW-Defined Storage Firm

For Open Compute Project and conventional NICs

Silicom Ltd. announced that a provider of hyper-converged software-designed storage systems will be using its next gen connectivity solutions to enhance the performance of its newest product lines.

To date, the customer has awarded Silicom a design win for two of its networking cards, one of which features an OCP (Open Compute Project) form factor. According to the customer’s projections, its orders for these cards will ramp gradually to a level of approximately $1 million per year.

In parallel, the client continues to consider and evaluate additional Silicom cards in a variety of connectivity speeds and form factors for potential future design wins. Based on the customer’s guidance, its total need for Silicom NICs could rise to approximately $4 million per year.

The fact that this storage solution innovator has turned to Silicom for performance-boosting connectivity components demonstrates the superiority of our technology and our ‘full-package’ support capabilities,” commented Shaike Orbach, Silicom’s president and CEO. “With data center workloads growing to unimaginable levels, clients recognize the need for the flexibility and dependability of our workhorse connectivity solutions – now more than ever.

“This win also demonstrates the importance of our investment in OCP-compliant products. As a standard that has already gained traction in high-density, connectivity-rich vloud infrastructures, we are seeing increased interest in our OCP offerings from a variety of players. We expect the interest to translate into additional design wins,” he added.

Silicom’s is in relationships with more than 150 customers throughout the world, with more than 400 active design wins and more than 300 product SKUs.

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