Hyperstone X1 SATA-III SSD Controller

Hyperstone GmbH introduces its X1 SATA-III SSD controller.

The X1 is targeting industrial and high-reliability SSDs, M.2 and U.2 modules, CFast cards and system-in-package eSSDs.

In conjunction with the company’s hyMap Flash Translation Layer (FTL), the FlashXE eXtended Endurance and hyReliability features, X1 guarantees low power consumption, power-fail robustness and a high reliability as well as comprehensive security features.

Product highlights:

• Designed to satisfy industrial requirements

• hyMap sub-page-based flash translation layer: unparalleled random write performance, minimal write amplification and highest endurance without external DRAM

• FlashXE eXtended Endurance read-channel including calibration and ECC with soft-decoding

• hyReliability flash management: superior wear leveling, read-disturb management and power-fail management

• Flash support: SLC, pSLC, 3D MLC, 3D TLC and next-generation NAND flash

• Protection against radiation and soft errors including end-to-end datapath protection, SRAM ECC and low-alpha package

• Up to 550MB/s transfer speed

• Low power consumption

• Comprehensive health-monitoring data and lifetime estimation tools

• Suited to M.2, U.2, 2.5-inch and 1.8-inch SSDs, CFast cards and embedded flash drives (eSSDs) or discrete on-board flash drive integration.

The X1 is the latest addition to the company’s portfolio of NAND flash controllers enabling industrial customers to benefit from a reliable and energy efficient SSD solution.

“The powerful dual-core processor along with end-to-end datapath protection, SRAM ECC and FlashXE are vital in guaranteeing an industrial reliable system with today’s 3D flashes” said Sandro-Diego Wölfle, product manager, Hyperstone. “Furthermore, the X1 provides extremely low power consumption, and as the silicon is designed for 125°C junction temperature, it can be used in 105°C environments.“

The X1 will initially be available in 144-ball TFBGA (10.4×10.4×1.1 mm) and 124-ball TFBGA (9x9x1.2 mm) packages, qualified for the industrial temperature range (-40°C to +85 °C). Mass production samples and released firmware are available.