Unigroup Starts Mass Production of 3D NAND Backend

To read this article from DigiTimes, click on:
Unigroup starts mass production of 3D NAND backend lines
Unimos Microelectronics, a re-invested memory backend service affiliate of China’s Tsinghua Unigroup, has recently kicked off volume production at its 3D NAND memory chips packaging and testing lines, marking a great stride by the group toward building sound memory and storage ecosystems.