CES: Toshiba Showcased BiCS FLASH 3D Flash Memory Solutions

At CES 2019, Toshiba Memory America, Inc. (TMA), the U.S.-based subsidiary of Toshiba Memory Corporation, has on hand to highlight its BiCS FLASH 3D technology – and the role it plays in the company’s latest flash memory, UFS, SSD, and KumoScale software products.

The company will also leverage CES as a stage to debut the fourth generation of its single-package ball grid array (BGA) SSD product line: the BG4 series.

Making its public debut at CES, the firm’s BG4 series – a lineup of ultra-compact, single-package NVMe SSDs – places both the flash and controller in one package, bringing flexibility to the design of ultra-thin notebooks, embedded systems and boot storage applications for servers and data centers. The BG4 series leverages the company’s 96-layer BiCS FLASH.

“Although we have been recognized as the inventor of flash memory and the first to introduce the concept of 3D flash memory, we are not content to simply rest on our laurels,” noted Scott Nelson, SVP and GM, memory business unit, Toshiba Memory America. “We continue to refine and push the technology forward in order to address storage challenges. This approach has made us one of the world’s largest flash memory suppliers and has enabled us to lead the way forward in the migration from floating gate to 3D and 96-layer BiCS FLASH QLC (quadruple-level-cell). We are also helping to chart the path forward in areas such as virtual reality, automotive infotainment, artificial intelligence, technology, and more.“