Phison Diversified SSD Controller Portfolio in 2018

Phison Electronics Corp. released a diversified SSD controller portfolio in 2018.

As 3D NAND production increases in 2018 and the cost hitting the sweet spot, the number of SSD projects surges, surpassing previous expectations. The company has confirmed over 35 designs for the SATA PS3111-S11 and PCIe PS5008-E8/E8T controllers.

The PCIe PS5012-E12 is receiving a response from the market with more than twenty projects kicking-off in a single month. With a total of over 100 SSD controller projects secured, the company as a top third party SSD controller IC manufacturer, is expecting an increase in product shipments and an increase in market share.

CS Ma, CTO, commented that the success of PS5012-E12 is the result of the company’s long-term technology investment and advancement. Many third party competitive analysis reports show that the PS5012-E12 is a PCIe Gen3x4 NVMe SSD controller. In addition to achieving the PCI-SIG compliance certification, the company released an enterprise optimized, PS5012-E12DC, to serve cloud, edge computing, block chain storage, and other high-end applications, driving a wide range of project designs and penetrating the new markets.

The PS5012 SSD controller utilizes a TSMC 28nm process. It maximizes the PCIe Gen 3×4 interface for read and write speeds of up to 3,450MB/s and 3,150MB/s respectively. It can reach device capacity of up to 8TB.

The PS5012-E12 based drives are capable of 600,000 in 4K random R/W performances (IO/s), nearly doubling competitor’s results. Its performance will meet the requirements of various high-end applications where the storage speed becomes critical, such as AI, mobile gaming computing, and enterprise data center applications. The PS5012 also supports Thunderbolt 3 external SSD designs, caching the Windows-based systems with burst speed and improved user experience.

The company plans its portfolio carefully, horizontally across different interfaces and vertically over the latest NAND technologies. The firm’s priority is to provide effective and reliable firmware solutions for the current mainstream TLC NAND and the next generations QLC NAND. The SmartTMECC is specifically designed for 3D TLC and QLC NAND of 96-layers or more. As the SmartTMECC advances into the 4th generation, this low-power LDPC ECC will become the best solution for the next generation QLC. The technology will enable a storage system that has a balance between memory capacity, R/W latency, and product reliability.