CES: Toshiba Memory America Unveils NVMe SSDs Including RC100 Series

At CES 2018, Toshiba Memory America, Inc. (TMA), U.S-based subsidiary of Toshiba Memory Corporation, will be highlighting the use of its BiCS FLASH 3D memory in several applications – including its lineup of NVMe SSDs, the RC100 Series.

Storage of tomorrow
At CES, the company is collaborating with its customers and technology partners to take on the future – together. The firm was the first company in the world ^[1] to announce 3D flash memory technology, which effectively addresses the processing, storage and management of the growing volume of data generated worldwide. Recent announcements includie the introduction of a 96-layer 512Gb die; the debut of the industry’s first ^[2] flash memory device with quadruple-level cell (QLC) technology; and the addition of Through Silicon Via (TSV) technology. Already enabling the enterprise, data center, PC and mobile applications of today, the BiCS flash has paved the way for the applications of tomorrow. from AI and virtual reality to a growing number of automotive applications (such as infotinment), HPC and the ever-expanding IoT, storage density needs will climb higher and higher – and BiCS flash was designed with this in mind.

CES – the biggest stage for consumer technology – is a forum for the inventor of NAND flash to introduce its innovations. Harnessing the power of its state-of-the-art 64-layer BiCS flash 3D memory, the company’s latest SSD innovation sits right in the sweet spot between SATA SSDs and higher-end NVMe SSDs. The RC100 Series was designed to address the entire spectrum of computing – and make the benefits of NVMe accessible to the mainstream market.

NVMe for everyone
Making its debut at CES, the RC100 M.2 NVMe SSD Series has been built  to deliver faster-than-SATA performance in a cost-effective and power-optimized solution for today’s DIY builders and PC gamers. A small 22x42mm form factor, low power consumption, performance and an affordable price all give the RC100 a true competitive edge.

Also at CES, the company’s storage group will demonstrate its small, sleek, ruggedized external SSD. The XS700 incorporates  BiCS flash and was designed with portability and affordability in mind.

⁽¹⁾ Prototype announced June, 2007
⁽²⁾ As of June 28, 2017, Toshiba survey