Intel Could License NAND Chip Technology to Tsin Unigroup

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Intel, Tsinghua Unigroup may team up to develop China NAND flash market
Intel is expected to enhance its presence in China’s NAND flash market, with plans to ramp up the capacity of its 12-inch fab in Dalian and possibly to license its technology to Tsinghua Unigroup for production of 3D NAND flash chips after winding up its cooperative partnership with Micron in the field in one year, according to industry sources.
The sources said Intel and Micron have announced intentions to go their separate ways after introducing their third-generation of 96-layer 3D NAND flash by the end of 2018 or early 2019 at the IM Flash Technologies (IMFT), their 12-year-old joint venture, with the exception for a special type of flash memory called 3D Xpoint.