Winbond Introduced TrustME Secure Flash Memory Aligned With Platform Security Architecture From ARM

Winbond Electronics Corporation announced an expansion of its TrustMESecure flash products portfolio aligned with Platform Security Architecture (PSA) from ARM Ltd.

As the industry’s first Common Criteria EAL5+ certified secure non-volatile memory, now with support for PSA, the TrustMEW75F secure flash enables system-on-a-chip (SoC) and micro-controller unit (MCU) vendors to design secure and certifiable solutions for the IoT, mobile, artificial intelligence and other demanding security applications. The foundational security principles of PSA combined with the company’s TrustME memory provide a solution for secure hardware designs, trusted boot, firmware confidentiality and integrity, trusted factory initialization of devices and secured firmware updates.

With the TrustME W75F technology, SoC and MCU designers can utilize any manufacturing process and connect to any secure flash density without being restricted to manufacturing only in process nodes capable of embedding flash memory cells. System designers can develop systems that are secure and scalable, in addition to being power-efficient and cost-effective.

Furthermore, the company’s expansion of TrustME W75F secure flash with PSA support enables secure execute-in-place (XIP) to ensure inherent root of trust, create mutual authentication with IoT cloud services, and securely store various keys, credentials, and certificates. The EAL5+ certified W75F secure flash provides protection against physical hacking attacks such as rollback, replay, man-in-the-middle, power analysis, and eavesdropping. Compared to conventional flash devices storing encrypted software, the secure XIP functionality of TrustME W75F secure flash eliminates the need for software shadowing and decrypting to additional RAM, achieving higher system level performance.

“Connected devices are being deployed at a rapid pace and to truly realize the benefits of these technologies, which have potentially life-changing implications, security can no longer be optional,” said Paul Williamson, VP and GM, IoT device IP, ARM. “This is a shared industry responsibility, which is why Arm is working with partners, including Winbond, to shift the economics of security by providing a common framework for building more secure connected devices through PSA.“

“In an increasingly security conscious world, robust solutions for trusted boot and firmware updates are indispensable to IoT security foundation. Winbond TrustME Secure Flash strengthens the robustness of PSA implementations by securing code and storage for trusted boot and firmware update using external secure flash,” said Hung-Wei Chen, MD, Winbond. “We look forward to continuing our support for secure memory solutions with our expertise and ability to meet the growing demand for secure and flexible solutions in the era of IoT.“

TrustME W75F secure flash feature:

• Security

  • • Common Criteria EAL5+ secure certification

    • Compliant with TCG Trusted Platform Architecture Hardware Requirements for a Device Identifier Composition Engine (DICE)

    • Individual device key for binding with master

    • Bus encryption with a strong, one-time key

    • Data integrity check

    • Protection against side-channel attacks (SCA)

    • Strong tamper-resistance features

    • Secure execution in place (S-XIP) operation

• Low power, wide temperature range

  • • Single 1.65 to 1.95V supply

    • 2mA active current, <1_A Power-down

    • -25°C to +85°C operating range

To meet the growing demand for high-volume embedded solutions, TrustME memories are manufactured in firm’s wholly-owned and secured 12-inch wafer fabrication facility in Taichung, Taiwan.

The first product in the family, the W75F32 at 32Mb density is in production and available for samples.

The company displayed TrustME W75F secure flash and was be conducting demonstrations at Arm TechCon, October 24-26 2017, at Santa Clara Convention Center, Santa Clara, CA.