Flash Memory Summit: Cnex Labs Supporting Toshiba BiCS Flash 3D Memory

CNEX Labs, Inc. announced support of Toshiba Memory Corporation BiCS FLASH 3D flash memory with Through Silicon Via (TSV) and 3-bit-per-cell (TLC) technology on its Westlake Plus NVMe SSD controller platform featuring one gigatransfer (one billion transfers) per second (GT/s) NAND interface speed, and demonstration of 1.5 Million IO/s read performance.

“Combining a 48-layer 3D flash process and TSV technology has allowed us to increase product read and programming bandwidth while achieving low power consumption,” said Hiroo Ohta, technology executive, Toshiba Memory Corporation. “The power efficiency of a single TSV package is approximately twice that of the same generation BiCS Flash memory fabricated without TSV technology.“

“CNEX is working closely with Toshiba Memory Corporation, the NAND flash industry leader, and is excited to demonstrate the latest innovation in flash technology coupled with CNEX’s advanced NVMe SSD controller to deliver the highest performance and lowest power in the industry,” said Dr. Alan Armstrong, CEO and co-founder, CNEX Labs. “Increases in SSD capacity typically are coupled with increased power consumption and reduced performance — CNEX’s NVMe SSD controller and Toshiba Memory Corporation TSV technology reverse this trend, delivering enterprise and data center customers high capacity drives with low power, combined with IO/s per terabyte scalability.“

The company’s controller technology supports existing BiCS FLASH 3D TLC flash, and also emerging technologies like TSV to bring performance to the high-growth cloud and enterprise markets.