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Yangtze River Storage 3D NAND Flash Development on Track

Fab installed in 1Q18
By Jean Jacques Maleval on 2017.03.16

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Yangtze River Storage 3D NAND flash development on track
Yangtze River Storage Technology's (YMTC) development of 3D NAND flash technology is well on track, and equipment for the production of 3D NAND chips will be installed at its fab in the first quarter of 2018, said company CEO Simon Yang. YMTC is engaged in the development of 32-layer 3D NAND flash chips, which will be in full production in 2019, according to Yang. The company aims to catch up with the world's leading memory vendors, in terms of technology, by 2020, he noted.

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