Rambus Signd Patent License Agreement With Winbond

Rambus Inc. announced it has signed a broad five-year patent license agreement with Winbond Electronics Corporation.

This agreement covers the use of Rambus patented memory solutions, including server DIMM chipsets, for Winbond products through 2021.

“In today’s data intensive applications, computing memory solutions must be more efficient, deliver higher levels of bandwidth and lower latency to solutions to meet the demands of the market,” said Luc Seraphin, GM, interface division, Rambus. “This collaborative partnership with Winbond provides critical memory and interface technologies that address the needs and requirements to run effective data centers.”

The company develops high-performance, low-power memory and SerDes interface chips and IP cores to meet the needs of increasingly diverse enterprise and mobile applications. The firm also drives innovations in silicon-to-cloud security, making digital products safer and better.