Toshiba Expands Industrial-Grade e-MMC Embedded NAND Flash Memory Products

Toshiba America Electronic Components, Inc. (TAEC) * announced the launch of its JEDEC ^[1] e-MMCVersion 5.1^[2] – compliant embedded NAND flash memory products that feature an enhanced operational temperature range of -40°C to +105°C.

These parts integrate NAND chips fabricated with 15nm process technology and are suited to industrial applications including PLC^[3] and CoMs ^[4], as well as factory automation equipment. This lineup includes densities of 8, 16, 32 and 64GB.

The number of consumer and industrial applications that utilize e-MMC for high-density, low power embedded memory continues to grow. As a result, the variety of e-MMC solutions needed to address these diverse requirements has expanded, as has the need for products with extended temperature ranges. The company is meeting the demand for high temperature solutions by adding to its lineup of high-performance, high-density e-MMC products.

As with firm’s existing e-MMC lineup, the new products integrate NAND chips with a controller to manage basic control functions for NAND applications in a single package. By supporting operational temperatures of 105°C, the e-MMC devices give developers a mass storage solution for industrial applications in high temperature environments.

Product lineup:

Product Name	Capacity	Category	Package
THGBMHG6C1LBAU6	8GB	Upper Extended Industrial Temp. (U-version)	11.5x13x0.8mm
THGBMHG7C2LBAU7	16GB		11.5x13x1.0mm
THGBMHG8C4LBAU7	32GB		11.5x13x1.0mm
THGBMHG9C8LBAU8	64GB		11.5x13x1.2mm

Key features:

Handles essential functions, including writing block management, error correction and driver software.
Simplifies system development, allowing manufacturers to minimize costs and speed up time to market for new and upgraded products.
Enhances usability with features^[5] standardized in JEDECe-MMC Version 5.1, including BKOPS control, cache barrier, cache flushing report, large RPMB write and command queuing.
Supports operational temperature range of -40°C to +105°C.

Key specifications:

Interface	JEDEC e–MMC V5.1 standard HS-MMC interface
Capacity	8, 16, 32, 64GB
Power supply voltage	2.7-3.6V　(memory core) 1.7V-1.95V, 2.7V-3.6V (interface)
Bus width	x1, x4, x8
Temperature range	-40^oC to +105^oC
Package	153Ball FBGA 11.5×13.0mm

Sample shipments begin, with mass production scheduled for March 2017.

Notes:
^[1] JEDEC is a registered trademark of JEDEC Solid State Technology Association.
^[2] e-MMC is a product category for a class of embedded memory products built to the JEDEC e-MMC Standard specification and is a trademark of the JEDEC Solid State Technology Association. The latest JEDEC e-MMC Version 5.1 specification was officially issued by JEDEC on February 24, 2015.
^[3] Programmable Logic Controller.
^[4] Computer on Modules.
^[5] ‘BKOPS control’ is a function where the host allows the device to perform background operation when the device is idle. ‘Cache Barrier’ is a function that controls when cache data is written to the memory chip. ‘Cache Flushing Report’ is a function that informs the host if the device’s flushing policy is FIFO (First In First Out) or not. ‘Large RPMB write’ is a function that enhances the data size that can be written to the RPMB area to 8KB. ‘Command Queuing’ feature allows users to process multiple tasks generated by the user’s issue of multiple commands, in the order of the user’s preference, by initially storing the tasks in a waiting queue. It improves random read performance speed by approximately 30% at maximum according to Toshiba survey.