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ATP From Taiwan Readies 3D NAND SSDs For Embedded Applications

Combined with wafer packaging and testing capabilities

ATP Electronics Inc., manufacturer of embedded flash and ruggedized SSD and DRAM modules, announces its next generation of storage solutions utilizing the latest 3D NAND flash technologies.

ATP,3D NAND SSDs

Combined with ATP’s wafer packaging and testing capabilities, these new lines of 3D NAND based SSDs including M.2, mSATA, SlimSATA, 2.5″ SSD, eUSB and memory cards, provide a new level of product differentiation targeting the industrial and embedded markets.

ATP will showcase these new solutions and related products at the Flash Memory Summit 2016 from August 9 to 11.

3D NAND technology is a transformational shift from the traditional SLC/MLC/TLC planar NAND technologies. It has become the new flash storage technology of choice, primarily focusing on both the client and enterprise SSD markets today.

Inevitably the 3D NAND usage will propagate to the embedded markets such as industrial, IoT, medical, automotive and telecom.

To be at the forefront of this technology shift, ATP has taken the initiative to adopt 3D NAND for its next generation embedded SSDs, in order to gain early understanding on the 3D NAND under extreme conditions, in order to better provide the solutions suitable for these niche markets where traditionally SLC/MLC technologies were deployed. 

In addition, by taking 3D NAND wafers to package its own BGAs and TSOPs and testing to specifications, ATP is able to provide various chip densities using DDP, QDP and even ODP die-stacking while using the same wafer stock. This provides not the flexibility in supply chain, but also enables the company to ramp multiple product densities quickly.

These new 3D NAND solutions benefit the embedded customers with the reliable, high available yet cost-effective storage solutions while mitigating supply risks in this volatile market.

In addition, at the FMS 2016 show, ATP will also share its experiences in addressing the challenges due to NAND technology limitations by the demanding embedded application requirements, with a presentation titled Optimizing Embedded SSDs for Performance and Beyond: A Prevention-Report-Analysis, on Wednesday August 10th, and also on Thursday, August 11th.

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