OCZ (Toshiba) Assigned Two Patents

Integrated storage/processing devices for performing big data analytics
OCZ Storage Solutions Inc., San Jose, CA, a Toshiba Group company, has been assigned a patent (8,996,781) developed by Schuette, Franz Michael, Colorado Springs, CO, Calder, Gary James, Eastleigh, Great Britany, Klein, Yaron, Raanana, Israel, and Smith, Stephen Jeffrey, Morgan Hill, CA, for a “integrated storage/processing devices, systems and methods for performing big data analytics.”

The abstract of the patent published by the U.S. Patent and Trademark Office states: ”Architectures and methods for performing big data analytics by providing an integrated storage/processing system containing non-volatile memory devices that form a large, non-volatile memory array and a graphics processing unit, GPU) configured for general purpose, GPGPU) computing. The non-volatile memory array is directly functionally coupled, local) with the GPU and optionally mounted on the same board, on-board) as the GPU.“

The patent application was filed on November 6, 2012 (13/669,727).

Modular mass storage system
OCZ Storage Solutions Inc., San Jose, CA, a Toshiba Group company, has been assigned a patent (8,995,137) developed by Schuette, Franz Michael, Colorado Springs, CO, for a “modular mass storage system and method therefor.”

The abstract of the patent published by the U.S. Patent and Trademark Office states: ”A modular mass storage system and method that enables cableless mounting of ATA and/or similar high speed interface-based mass storage devices in a computer system. The system includes a printed circuit board, a system expansion slot interface on the printed circuit board and comprising power and data pins, a host bus controller on the printed circuit board and electrically connected to the system expansion slot interface, docking connectors connected with the host bus controller to receive power and exchange data therewith and adapted to electrically couple with industry-standard non-volatile memory devices without cabling therebetween, and features on the printed circuit board for securing the memory devices thereto once coupled to the docking connectors.“

The patent application was filed on April 19, 2013 (13/866,098).