128GB FlashEmbedded Memory for Smartphones by Samsung

Samsung Electronics Co., Ltd. announced that it is mass producing an 128GB fast embedded memory based on the much-anticipated Universal Flash Storage (UFS) 2.0 standard for next-generation flagship smartphones.

The embedded memory’s UFS 2.0 interface is an advanced JEDEC-compliant, next-generation flash memory storage specification.

“With our mass production of ultra-fast UFS memory of the industry’s highest capacity, we are making a significant contribution to enable a more advanced mobile experience for consumers,” said Jee-ho Baek, SVP, memory marketing, Samsung Electronics. “In the future, we will increase the proportion of high-capacity memory solutions, in leading the continued growth of the premium memory market.“

UFS memory utilizes Command Queue, a technology that accelerates the speed of command execution in SSDs through a serial interface, increasing data processing speeds compared to the 8-bit parallel-interface-based eMMC standard. As a result, UFS memory conducts 19,000 IO/s for random reading, which is 2.7 times faster than the most common embedded memory for high-end smartphones today, the eMMC 5.0. It also delivers a sequential read and write performance boost up to SSD levels, in addition to a 50% decrease in energy consumption. In addition, the random read speed is 12 times faster than that of a typical high-speed memory card (which runs at 1,500 IO/s), and is expected to improve system performance.

In the future, Samsung anticipates that UFS will support high-end mobile market needs, while eMMC solutions remain viable for the mid-market, value segments.

For random writing of data to storage, the blazingly fast UFS embedded memory operates at 14,000 IO/s and is 28 times as fast as a conventional external memory card, making it capable of supporting seamless Ultra HD video playback and smooth multitasking functions at the same time, enabling a much improved mobile experience.

Samsung’s UFS embedded memory comes in 128, 64 and 32GB versions, which are twice the capacity of its eMMC line-up, making it a memory storage solution for high-end mobile devices.

Samsung’s UFS embedded memory package, a ePoP (embedded package on package) solution, can be stacked directly on top of a logic chip, taking approximately 50% less space.