55nm Embedded SuperFlash Memory Platform and 40nm License Available at Silicon Storage and UMC

Microchip Technology Inc., through its Silicon Storage Technology subsidiary, and United Microelectronics Corporation (UMC), announced the qualification and availability of SST’s 55nm embedded SuperFlash non-volatile memory on UMC’s 55nm platform.

UMC extended its licensing agreement to include SST’s 40nm embedded Flash (IP. The qualification of UMC’s 55nm, split-gate-cell SuperFlash technology-based process was performed according to JEDEC standards, and showed 100k endurance with more than 10 years of data retention at 85°C and an operating-temperature range of -40°C to 125°C.

Microchip, provider of microcontroller, mixed-signal, analog and flash-IP solutions,, provides product development, lower total system cost and faster time to market for thousands of diverse customer applications worldwide. Headquartered in Chandler, AZ, it offers technical support along with dependable delivery and quality.

Today, the value of an average car’s semiconductor content has grown to about $350, with more than 60% of that content comprising microcontrollers (MCUs) and analog. Embedded flash is a component in the majority of those automotive MCUs.

Gartner predicts that there will be 25 billion connected things in use by 2020, and many of those Internet of Things (IoT) products will contain at least one MCU with embedded flash. To date, more than 50 billion devices have shipped with SST’s SuperFlash technology, and the growing automotive and IoT markets are two examples of the continued need for this IP.

“Our latest agreement underscores UMC’s strong commitment to technology leadership,” said Mark Reiten, VP technology licensing, SST. “Additionally, this expanded partnership further strengthens our market leadership in embedded, flash-based devices for automotive, industrial, consumer and IoT applications.“

“UMC is pleased with the results of SST’s 55nm SuperFlash technology, having successfully engaged with multiple customers,” said S.C. Chien, VP, specialty technology development, UMC. “UMC continues to grow customer deployments of our 55nm SuperFlash technology-based platform in broad markets such as automotive, industrial, consumer and IoT, and we are committed to continuing that success by extending our partnership to include SST’s 40nm technology.“

SuperFlash technology complements UMC’s embedded memory portfolio, by enabling high-density and performance-driven IC designs. UMC’s ample capacity and high yield maturity for 55nm/40nm helps its foundry realize more than 30% of its revenue contribution from these mainstream nodes. Several variations of UMC’s 55nm and 40nm processes are available, including the ultra-low-power 55uLP and 40uLP processes, which were developed for today’s portable applications that demand longer battery life.