Spansion and China’s XMC Expand Partnership

Spansion Inc. and XMC, China’s growing 300mm semiconductor foundry, will work together to develop and manufacture 3D NAND technology.

The companies have signed development and cross-licensing agreements.

According to TechNavio, 3D NAND is expected to grow at a CAGR of over 180% by 2018. The increase in memory requirements and demand for low form factors for NAND flash is contributing to this growth.

“The explosion of data created by the rapid growth of the Internet of Things and more advanced automotive systems is placing greater demands on storage technologies. 3D NAND will revolutionize how data will be more efficiently stored in the future,” said Ali Pourkeramati, SVP of strategic alliances, Spansion. “Our leading charge trap MirrorBit technology, which we invented over 10 years ago, will be the key advantage for 3D NAND innovation and will provide unparalleled high-performance storage.”

“We are pleased to co-develop 3D NAND technology with Spansion,” said Michael Chen, chief business officer, XMC. “XMC will continue to leverage its leading edge manufacturing capabilities, extensive volume production experience with charge trap technology and world-classR&D team in memory expertise. By partnering with Spansion, we are confident to successfully bring innovative 3D NAND technology to market.“

The first 3D NAND products will be available in 2017.