Molex iPass+ High-Density Interconnect System

Molex Incorporated announces its iPass+ High-Density Interconnect System comprised of host-side board connectors, internal and external copper cable assemblies and Active Optical Cables (AOCs) capable of transporting SAS 3.0, 12Gb signals in lengths up to 100 meters.

The enhanced iPass+ HD system is desgned and engineered to meet the new performance standards for speed and density.

Jay Neer, Molex  industry standards manager, notes: “The need for scaling enterprise storage solutions continues to grow, fueled by the exponential growth of on-demand information and entertainment networks and big data analytics. Molex is proud to be first-to-market with a comprehensive, integrated SAS-3 interconnect solution that will enable data center architects to design and deploy larger, faster and more reliable storage systems, and allow enterprise users to scale up their storage capabilities as their requirements evolve and grow.“

These new Molex products provide nearly double the density of current QSFP+ solutions making the iPass+ HD Interconnect System for use in large-scale data centers and enterprise multi-rack storage systems, as well as RAIDs and other data networking and storage applications. The HD products are compliant with SAS 3.0 (12Gb) systems and are backward compatible with SAS 2.1 (6Gb) ystems.

iPass+ HD Interconnect family of products includes:

• External passive copper cable assemblies (4x and 8x)
• Internal passive cable assemblies (4x and 8x)
• External integrated cage and receptacles (4x, 8x and 16x)
• Internal right angle and vertical receptacles (4x, 8x and 16x)
• External Active Optical Cable assemblies (4x AOCs)

These products are also compatible with the data rates for 10Gb IB QDR, 10GbE, 8Gb FC, 40GbE (4x10G) and 56Gb (4x14Gb) IB FDR.