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ONFI 3.2 Standard Extends Non-Volatile DDR2 Interface

From 400MB/s to 533MB/s, next step being 800MB/s

The Open NAND Flash Interface (ONFI) Working Group, the organization dedicated to simplifying integration of NAND Flash memory into CE devices, computing platforms, and industrial systems, published the new ONFI 3.2 standard.

It extends the non-volatile DDR2 (NV-DDR2) interface from 400MB/s to 533MB/s, providing a performance boost of up to 33% for high performance applications enabled by SSDs.

The ONFI 3.2 standard includes two BGA package definitions that provide four concurrent channels of NAND, allowing for over 2GB/s of performance out of a single NAND package. The package definitions have been developed in collaboration with the JEDEC Solid State Technology Association, ensuring interoperability across all NAND vendors.

"Members of JEDEC’s JC-42.4 Subcommittee were pleased to collaborate with ONFI to develop package definitions for the new specification," said Cecil Ho, subcommittee chairman. "This is indeed a reference document that design engineers will find helpful in enabling broader use of NAND flash."

Additionally, ONFI has begun work on its next generation specification – ONFI 4.0 – targeting speeds up to 800MB/s. While pushing the envelope of performance, it is also focused on reducing power by lowering voltages and employing other power saving measures.

"ONFI has been working since 2006 to deliver NAND interface standards the industry needs to enable exciting applications utilizing high performance SSDs," said Amber Huffman, senior principal engineer, Intel Corp.‘s storage technologies group and chairperson for the ONFI Workgroup board of directors. "ONFI 3.2 enhances performance today and ONFI 4.0 will push the envelope on both performance and power to enable continued innovation in handheld, client, and Datacenter platforms."

The ONFI Working Group was formed in May 2006 and currently has more than 100 member companies. Founding companies include Intel Corporation, Micron Technology, Inc., Phison Electronics Corporation, SanDisk Corp., SK Hynix, Sony Corporation and Spansion, Inc.

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