IBM Assigned Two Patents

Reducing Power Consumption Based on Storage Device Data Migration

IBM Corp., Armonk, NY, has been assigned a patent (8,291,245) developed by Lu Nguyen, Tampa, FL, and Mark J. Seaman, San Jose, CA, for a “method, apparatus and system for reducing power consumption based on storage device data migration.”

The abstract of the patent published by the U.S. Patent and Trademark Office states: “The invention provides a method, apparatus and system for reducing power consumption involving data storage devices. One embodiment involves storing data in a first memory; in response to the first memory exceeding a first threshold, migrating the data from the first memory to a second memory; in response to the second memory exceeding a second threshold, then activating a third memory if the third memory is in active; and in response to the second memory exceeding a third threshold greater than the second threshold, migrating the data from the second memory to a third memory; wherein the second memory is sized and configured to store data targeted for the third memory to intelligently maintain a portion of the third memory in an inactive state.”

The patent application was filed on June 25, 2009 (12/492,056).

High Density Data Storage and Imaging

IBM Corp., Armonk, NY, has been assigned a patent (8,289,833) developed by 12 co-inventors for a “method for high density data storage and imaging.”

The co-inventors are Urs T. Duerig, Rueschlikon, Switzerland, Jane Elizabeth Frommer, San Jose, CA, Bernd Walter Gotsmann, Horgen, Switzerland, Erik Christopher Hagberg, Evansville, IN, James Lupton Hedrick, Pleasanton, CA, Armin W. Knoll, Zurich, Switzerland, Victor Yee-Way Lee, Teddie Peregrino Magbitang, Robert Dennis Miller, San Jose, CA, Russell Clayton Pratt, Charles Gordon Wade, Los Gatos, CA, and Johannes Windeln, Bodenheim, Germany.

The abstract of the patent published by the U.S. Patent and Trademark Office states: “An approach is presented for designing a polymeric layer for nanometer scale thermo-mechanical storage devices. Cross-linked polyimide oligomers are used as the recording layers in atomic force data storage device, giving significantly improved performance when compared to previously reported cross-linked and linear polymers. The cross-linking of the polyimide oligomers may be tuned to match thermal and force parameters required in read-write-erase cycles. Additionally, the cross-linked polyimide oligomers are suitable for use in nano-scale imaging.”

The patent application was filed on Oct. 18, 2011 (13/275,441).