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Seagate Assigned Patent

Head suspension assembly interconnect for storage device

Seagate Technology LLC, Cupertino, CA, has been Assigned a patent (8,233,243) developed by Hong Zhu, Bloomington, MN, and Michael E. Wissbaum, Eagan, MN, for a "head suspension assembly interconnect for a data storage device."

The abstract of the patent published by the U.S. Patent and Trademark Office states: "Interconnections for attaching a suspension assembly to an arm of an actuator or positioning device are disclosed. In illustrated embodiments, the interconnection includes one or more weld connections formed along opposed side seams of overlapping portions of the arm and head suspension assembly. In illustrated embodiments, the weld connections are formed along side surfaces generally transverse to upper and lower surfaces of the arm. In another embodiment, a groove pattern is formed, for example via a laser etching process, in an overlapping portion of the head suspension assembly or arm and an epoxy is inlayed in the groove to connect the head suspension assembly and arm. Illustrated embodiments also include multiple connections including, for example, a swage connection and a weld or other connection."

The patent application was filed on Dec. 10, 2008 (12/331,606).

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