37GB and 75GB on Microsemi Compact SATA SLC BGA SSD

Microsemi Corporation launched the first in a family of SATA storage systems for secure embedded defense applications.

The compact MSM37 and MSM75 solutions are each packaged as a single 32x28mm 522 PBGA (plastic ball grid array) and provide up to 75GB of NAND flash solid state storage for applications where a full-size 2.5 inch storage device is too large.

Security features include AES-128 encryption, self-destruct capability and whole-module erase with ‘push-button’ trigger option for mission-critical defense and aerospace applications, ruggedized mobile systems, surveillance, avionics, navigation and ruggedized portable storage solutions.

"Our ability to miniaturize microelectronics systems has proven to be a key advantage in defense applications where SWaP solutions are critical," said Jack Bogdanski, director of marketing for Microsemi. "Offering a complete solid state storage system in a compact module allows designers to add more features to their systems, while supporting key security features that are increasingly important to our defense and aerospace customers."

The BGA package, available in 37 and 75GB densities, combines a SATA flash controller with SLC NAND flash. The device includes a single supply with extended hold-up time without super caps or batteries. The BGA saves up to 60 percent board space when compared with a similar PCB design.

Key Features

• Density – 37 and 75 GB
• Host interface – 1.5 Gb/s and 3 Gb/s SATA
• Measures 32mm x 28mm
• Available in a 522 PBGA package
• Offers 60 percent space savings as compared to PCB solutions with similar capabilities
• Lead or RoHS balls
• AES-128 encryption running CTR mode
• Self-destruct capability
• Power interruption protection
• Support for military sanitization protocols
• No batteries or super capacitors

Microsemi has design, manufacture and test capabilities for a variety of multiple component packages (MCPs), commercial-off-the-shelf (COTS) memory, processors and combination MCPs for demanding applications. These microelectronic products can also be ruggedized and processed for tamper resistance. All devices are subjected to extensive environmental and temperature testing.

Microsemi’s facility in Phoenix, Ariz. is a DOD Trusted Source and DMEA accredited for assembly and test. Its quality and inspection system requirements are certified to MIL-PRF-38534 Class H and K, MIL-PRF-38535 Class B, ISO 9001:2008 and AS9100.