LeCroy Mid-bus Probe for PCIe 3.0

LeCroy Corporation, supplier of oscilloscopes and serial data test solutions, introduced a new mid-bus probe for the Summit T3-16 Protocol Analyzer, supporting the PCI Express 3.0 specification (8 GT/s data rates). The mid-bus probe can be connected to systems that utilize the Intel mid-bus probe footprint specification.

Mid-bus probes are used by system developers to probe embedded bus signals (e.g., for serial data buses that run between chips on a single circuit board), or simply as a convenient means to access bus signals with a probe connector. The probe is easily attached to an anchor connector mounted on top of a mid-bus footprint that is laid out on the test target system board.

The LeCroy mid-bus probe uses a full-size connector that supports PCIe x8 lanes at 8 GT/s. Two mid-bus probes can be connected to a Summit T3-16 Analyzer and will support x16 lane widths. These probes can be used in conjunction with the unique lane swizzling feature on the Summit T3-16 Analyzer, which allows probe signals to be reorganized logically, to give developers flexibility in PCB layout.

"Mid-bus probes are a key tool for early developers of PCIe 3.0 systems," said John Wiedemeier, Product Marketing Manager, LeCroy. "Enabling bus probing allows for rapid development of new system designs. Our customers have come to depend on the high quality probing solutions from LeCroy to insure successful power-on schedules for the next generation of high performance I/O."

LeCroy protocol analyzers have been at the forefront of PCI Express development tools. All LeCroy protocol analyzers feature a hierarchical display, real-time statistics, protocol traffic summaries, detailed error reports, powerful scripting, and the ability to create user-defined test reports, which in combination provide a powerful analysis system to allow developers to troubleshoot intricate problems and to finish their projects on time.

Availability
The mid-bus probe is now available to order.