ATP USB Flash Modules Ranging From 512MB to 8GB

ATP, Inc., a manufacturer of high performance flash and DRAM memory, announces its embedded USB flash modules, a line up of reliable, high performance solid state storage for embedded, networking, server platforms, and other industrial applications. Armed with the latest in wear leveling and onboard ECC technology, the ATP USB flash modules are immediately available in densities ranging from 512MB to 8GB, and will be showcased along with other ATP memory solutions at the 2009 International CES in Las Vegas on January 8-11.

"Working closely with many of our core partners, ATP has already been building and supporting similar solutions for many of their specialized applications so this expertise and product development was formalized into this product line. Our embedded USB flash module product is extremely compact, bootable for most systems/operating systems, and offers all the performance and durability advantages of solid state storage," said Michael Plaksin, ATP Vice President of Sales. "This suits a specific need for a bootable solid state solution which is easy to implement to many existing platforms."

"ATP’s extensive knowledge as a true manufacturer allows us to offer our BOM control and customization services to this product line, maximizing system performance for specialized applications as requested by our customers," Plaksin continued.

ATP embedded USB’s features:

• High IOPS (Input/Output Operations per Second)
• Wide Operating temperature Range
• Onboard ECC
• Advanced Block Management
• Advanced Wear Leveling
• Support: bootable, AWARD BIOS update
• Fixed disk mode or removable mode configurable
• Available with low profile 2.00M connector or standard 2.54M connector
• Dimension: 1.45 x 1.04 x 0.40"

ATP Industrial Grade embedded USB flash modules are specifically designed for substantially longer lifetimes and environmental durability compared to commercial grade products found in the marketplace today. Each design goes through a significant amount of endurance and environmental testing levels beyond product specification.

At the production level, all products go through a multi-cycle 100% bit-level, burn-in process running through multiple data patterns. The multiple data patterns are designed specifically to test these NAND components for a variety of conditions to ensure consistent data integrity in all data applications.