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Probably World’s First USB 3.0 Storage Solutions at CES

Using PHY from start-up Symwave

Symwave, Inc., a semiconductor supplier of analog/mixed-signal connectivity solutions for the PC, consumer and mobile devices, will demonstrate at CES, the world’s first consumer application of SuperSpeed USB 3.0, which is 10 times faster than legacy USB technology. Symwave is collaborating with the leading test, cable, components and hard drive manufacturers to demonstrate the transfer speeds of USB 3.0 and will showcase streaming data to and from external storage devices at speeds previously unattainable.

SuperSpeed USB 3.0 is poised to become the most pervasive high-speed connectivity technology over the coming years. It is backwards compatible with the more than 10 billion USB devices shipped to date. Just last month, Symwave announced the world’s first USB 3.0 physical layer device (PHY) at the same time as the first public release of the Revision 1.0 Specification at the SuperSpeed USB Developers Conference.

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Fabless semiconductor start-up company was incorporated in 2004 and is headquartered in Orange County, CA, with R&D in Shenzhen, China. The firm is backed by venture capital firms including Kodiak Venture Partners and CMEA Ventures, among others, and completed a $12 million Series C financing round last year.

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