Microdata Assigned Patent
Addressable objects storage container with interconnect panel
By Francis Pelletier | November 11, 2016 at 2:37 pmMicrodata Corporation, San Jose, CA, has been assigned a patent (9,469,150) developed by Zhu, Shengbo, San Jose, CA, and Huang, Su Shiong, Bellevue, WA, for a “addressable objects storage container with interconnect panel.“
The abstract of the patent published by the U.S. Patent and Trademark Office states: “A storage container and matching cover for storing addressable objects. The storage container has an interconnect panel with a pair of laterally spaced address signal conductors extending vertically along the panel and terminating at the top and bottom edges of the panel in conductive terminal pads. The cover has an interconnect mechanism with spring biased translatable conductive probes positioned to mate with the conductive terminal pads of an upper and lower container when two containers are vertically stacked. The combination of the container and cover eliminates the need for individual USB jumper cables when interconnecting two or more vertically stacked containers. An auto alignment feature ensures that the containers are properly stacked with the terminal pads in contact with the conductive probes.“
The patent application was filed on October 15, 2014 (14/121,761).