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FMS 2025: Best of Show Award Winners 2025

Leaders of Memory and Storage Technology Innovation and Industry Expansion Accept Prestigious Awards

FMS 2025: The Technology Timeline Continues to Highlight the Industry and its Various Notable Developments

New events have been added since FMS 2024 | by Philippe Nicolas

FMS 2025: Kioxia LC9 Series 245.76TB Enterprise SSD with 32-die Stack Memory Named ‘Best of Show’

245.76TB NVMe SSD in 2.5-inch and EDSFF E3.L form factor

FMS 2025: Phison and Supermicro Collaboration Delivers Storage Density for AI and Hyperscale Workloads

Using Supermicro's Petascale storage family and Phison’s high-capacity 122.88TB Pascari D205V SSD, featuring E3.L form factor and Gen5 NVMe performance
ExaGrid

FMS 2025: Chelsio Sampling T7 DPU Platform

Available in 2 ASIC variants: T7 full-featured DPU silicon for storage appliances, security platforms, and AI networking, and S7 cost-optimized, DRAM-less variant designed for high-volume cloud and server environments

FMS 2025: Silicon Motion Showcases MonTitan SM8366 in Core to Edge AI Server Applications

Demos MonTitan SM8366 controller based Unigen Cheetah SSDs on VAST Data Ceres V2 platform, and based on Innodisk 5TS-P SSDs with Aetina’s MGX-based AEX-2UAI edge server

FMS 2025: Macronix Introduces ArmorBoot MX76 Secure-Boot NOR Flash Memory

Features ultra-fast boot times, high performance, integrated authentication protection, data integrity verification, secure update, SPI interface, and low-power options

FMS 2025: NEO Semiconductor Introduces Extreme High Bandwidth Memory (X-HBM) Architecture for AI Chips

X-HBM architecture delivers 32K-bit wide data bus and potentially 512Gb/die density, offering 16X more bandwidth or 10X higher density than traditional HBM
AIC

FMS 2025: XCENA Unveils MX1 Computational Memory Supporting PCIe 6.0 and CXL 3.2

MX1 provides SSD-backed memory expansion, delivering PB-scale capacity with minimal latency overhead

FMS 2025: Wolley Introduces CXL Memory Expansion Controller for AI Workstation

Extends memory bandwidth and allows the AI Workstation to run LLM easily

FMS 2025: Sandisk to Collaborate with SK hynix

To drive standardization of high bandwidth flash memory technology

FMS 2025: UCIe Consortium Introduces 3.0 Specification With 64GT/s Performance and Enhanced Manageability

UCIe-S and UCIe-A to power next-gen multi-chip systems for evolving use cases, which demand higher bandwidth density, such as AI, by doubling data rate while maintaining low power.
ATTO

Podcast: Interview with Chris Stott, CEO, Lonestar

Episode 273 of The French Storage Podcast | by Philippe Nicolas

R&D: Goldak’s Double Ellipsoidal Thermal Profile Model of Transition Jitter and Signal-to-noise Ratio for HAMR

Work uses a new thermal profile model, Goldak’s double ellipsoidal heat source to simulate a moving heat spot.

Avago Technologies International Sales/Broadcom Assigned Patent

Compute Express Link (CXL) Over Ethernet (COE)
Recent News

FMS 2025: Adaptec SmartRAID 4300 Series of Accelerators Deliver Scalable, Secure NVMe RAID Storage Solutions

Top NewsFMS 2025: Sandisk Unveils UltraQLC Technology Platform with Up to 256TB Enterprise SSD Capacity[comments]

OPEN-E

FMS 2025: Pliops Unlocks GenAI Inference with Smarter, Persistent Memory

FMS 2025: XConn and ScaleFlux Partner to Optimize CXL 3.1 Interoperability for AI and Cloud Infrastructure

FMS 2025: Celestica Introduces SC6110 Enterprise Storage Controller

FMS 2025: AIC to Showcase High-Performance AI Storage and Memory Solutions

FMS 2025: H3 Platform Debuts CXL Memory Sharing and Pooling Solution

FMS 2025: Pure Storage Highlights Hyperscale Architecture

FMS 2025: Teradyne Unveils Magnum 7H Next-Gen Memory Tester for High Bandwidth Memory Devices

FMS 2025: NVM Express Touches Down, NVMe Spec Updates, Product Demos and Beyond

FMS 2025: NVM Express Publishes Set of NVMe Specifications

FMS 2025: UALink Consortium Highlight Applications

Topgolf Selects VergeOS to Power Infrastructure Across 100+ Venues, Offices and Core Data Centers

TelSwitch Chooses Graid Technology

R&D: PS-WL, Probability-Sensitive Wear Leveling Scheme for SSD Array Scaling

UnifabriX Assigned Patent

Top NewsCompany Profile: Phison Electronics[comments]

FMS 2025: Kioxia Showcases Breakthrough Flash Storage Solutions

FMS 2025: Graid Technology Introduces SupremeRAID HE for HA HPC and AI Workloads 

FMS 2025: Advantest Showcasing Latest Memory Test Solutions

DDN Powers the AI Factory of the Future with Record-Breaking Performance Density

Acumera Acquires Scale Computing, Expanding Edge Computing Across Distributed Enterprises and MSPs

Observe Closes $156 Million Series C as Enterprises Shift to AI-Powered Observability at Scale

Oxide Raises $100M Series B to Scale Cloud Infrastructure for On-Premises Computing

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