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Toshiba e-MMC Embedded NAND Flash Products Up to 128GB

Chips utilizing 15nm process

Toshiba America Electronic Components, Inc. (TAEC) announced a class of e-MMC embedded NAND flash memory products that are among the world’s smallest.

Toshiba,e-MMC,15nm f3

The new products integrate NAND chips fabricated with Toshiba’s cutting-edge 15nm process technology and a controller to manage basic control functions for NAND applications into a single package.

Fully compliant with the latest JEDEC e-MMC standard, the new chips are designed for application in a range of digital consumer products, including smartphones, tablet PCs and wearable devices. Sample shipment of 16GB products begins now, with 8GB, 32GB, 64GB, and 128GB products to follow.

By utilizing the 15nm process technology, the new product’s package size is approximately 26% smaller than comparable Toshiba products and offers faster R/W performance due to improvements in basic chip performance and controller optimization. The read speed is approximately 8% faster (max.), while the write speed is approximately 20% faster (max.).

With the introduction of 15nm-based e-MMC, Toshiba continues to demonstrate its leadership in NAND flash and embedded memory solutions targeting mobile and wearable devices,” noted Scott Beekman, director of managed NAND memory products, TAEC. “The small 11x10mm package, supporting a wide range of densities, is well-suited for increasingly space limited applications.

Demand continues to grow for large density NAND flash memory chips that support high resolution video and deliver enhanced storage. This is particularly true in the area of embedded memories with a controller function, which minimize development requirements and ease integration into system designs. Toshiba is meeting this demand by reinforcing its line-up of high performance and high density memory products.

New Product Line-up
Toshiba,e-MMC,15nm f1
*In Toshiba e-MMC categories, Supreme represents products suited to high-end class applications and Premium represents products for middle- and low-end class applications.

Key Features
The JEDECe-MMC compliant interface handles essential functions, including writing block management, error correction and driver software. It simplifies system development, allowing manufacturers to minimize development costs and speed up time to market for new and upgraded products. Additionally, new features among them BKOPS control, Cache Barrier, Cache Flushing Report, and Large RPMB Write, are applied to the new products to enhance usability. BKOPS control is a function where the host allows the device to perform background operation during the device’s idle time. Cache Barrier is a function that controls when cache data is written to the memory chip. Cache Flushing Report is a function that informs the host if the device’s flushing policy is FIFO or not. Large RPMB write is a function that enhances the data size that can be written to the RPMB area to 8kB. Functions were not present in prior Toshiba models.

The 8GB to 64GB products are sealed in a FBGA package measuring 11x10mm and are suitable for smartphones, tablet PCs and wearable devices where miniaturization and weight saving are a requirement.

Embedded in a system, the 128GB products can record up to 16.3 hours of full spec high definition video and 39.7 hours of standard definition video.

Key Specifications
Toshiba,e-MMC,15nm f2

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