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Toshiba BG SSDs With TLC BiCS Flash

Up to 512GB in 16x20mm NVMe form factor

Toshiba America Electronic Components, Inc. (TAEC) will showcase its new BG series SSD family featuring BiCS FLASH with 3-bit-per-cell TLC technology and Toshiba’s new single-package ball grid array (BGA) NVMe PCIe Gen3 x2 SSD at the 2016 Flash Memory Summit held in Santa Clara, CA, between August 8-11.

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Delivering a smaller footprint (compared to M.2 Type 2280-S2), lower power consumption (compared to Toshiba’s existing SATA SSD devices) and better performance (compared to SATA SSD devices in the aspect of sequential read performance) than traditional storage options, the BG SSD series is purpose-built for the future wave of thin mobile PCs, including 2-in-1 convertible notebooks and tablets.

With a surface area 95% smaller than conventional 2.5-inch SATA storage devices and 82% smaller than M.2 Type 22806, the BG series condenses both the controller and NAND flash memory in a single 16x20mm BGA package enabling device manufacturers to prioritize features like battery capacity for longer operating times.

The BG series is also available mounted on a M.2 Type 22307 module for applications requiring socketed storage.

BG SSDs utilize BiCS FLASH, a 3D stacked cell structure (a structure stacking flash memory cells vertically on a silicon substrate to realize significant density improvements over planar NAND flash memory, where cells are formed on the silicon substrate), making it possible to accommodate up to 512GB of storage capacity in this compact form factor. Additionally, the BG series SSDs utilize an in-house Toshiba-developed controller and firmware for a vertically developed solution, ensuring technology is tightly for performance, power consumption and reliability.

We are thrilled to unveil the new BG series with BiCS FLASH which will deliver both a rich feature-set and high performance all within an extremely small footprint and power profile,” said Jeremy Werner, VP of SSD marketing and product planning, TAEC. “We expect to be in production this year with BiCS FLASH BGA SSDs, offering our customers a compelling and cost-effective storage solution for the next generation of high performance ultra-thin and light notebooks and tablets.”

To deliver a more compact and power efficient drive, while still delivering performance in client workloads, the BG series implements the latest NVMe standard Host Memory Buffer (HMB) feature which will be showcased during the 2016 Flash Memory Summit. HMB allocates and employs host DRAM for flash management purposes in contrast to alternative solutions that contain costly and power-hungry dedicated DRAM to perform similar functions. This technology can enable increased performance over solutions without DRAM by storing lookup data on host memory to reduce access times for commonly accessed data.

The BG SSD family will be available in 128GB, 256GB or 512GB capacities in both a 16x20mm package (M.2 Type 1620) or a removable M.2 Type 2230 module.

Samples of Toshiba BGA SSDs are initially available for limited PC OEMs, and will be available for other customers to develop with in the fourth calendar quarter of 2016.

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