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SST/Microchip and Globalfoundries Qualify Automotive Grade 55nm Embedded Flash Memory Technology

Process performed according to JEDEC standards

Microchip Technology Inc., a provider of micro-controller, mixed-signal, analog and Flash-IP solutions, through its Silicon Storage Technology, Inc. (SST) subsidiary, and GLOBAL FOUNDRIES, Inc., a provider of semiconductor manufacturing technology, announced the qualification and availability of SST’s 55nm embedded SuperFlash non-volatile memory (NVM) on Global Foundries’ 55nm Low Power Extended (LPx)/ RF enabled platform.

The qualification of GLOBALFOUNDRIES’ 55nm, split-gate-cell SuperFlash technology-based process was performed according to JEDEC standards. This process technology also met the requirements of AEC-Q100 Grade 1 qualification with an ambient temperature range of -40°C to 125°C, and demonstrated endurance of 100K program/erase cycles with more than 20 years of data retention at 150°C.

According to information company IHS Technology, the automotive semiconductor market is forecast to reach $31 billion in 2015, with a 7.5% improvement over 2014. Embedded Flash-based semiconductors are a key component of this market segment.

Embedded SuperFlash memory is a de-facto standard at foundries for micro-controllers, smart-cards, and various system-on-chip devices,” said Mark Reiten, VP of technology licensing, SST. “Global Foundries has been a great partner for building a state-of-the-art 55nm embedded SuperFlash platform, and we are already engaged with several customers in various market segments. We are pleased to partner with Global Foundries, to further strengthen our market leadership in embedded Flash-based devices.

Global Foundries recognizes the need to provide a low-cost embedded Flash platform for secure ID, mixed-signal, NFC/RF and next-generation IoT applications,” said Gregg Bartlett, SVP of product management, Global Foundries. “Our deep collaboration with SST has resulted in qualified, commercially available 55nm SuperFlash technology on Global Foundries’ high-yielding 55nm low-power process platform, which will enable high-performance solutions for customers across key market segments.

Global Foundries’ 55nm LPx/RF platform, complete with eNVM technology, is available. This platform technology offers a fast path-to-product solution, with a custom library of off-the-shelf eNVM IP blocks that are optimized for specific MCU product applications.

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