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SSD ASIC Capabilities From Global Unichip Corp.

Solution covers front end design to packaging capabilities and targets TSMC 28nm process technologies.

Global Unichip Corp. (GUC) rolled out its complete portfolio of SSD ASIC capabilities..

The company’s SSD solution covers application-specific front end design capabilities, advanced node design flow experience, robust manufacturing management, and a production-proven IP set targeting TSMC (Taiwan Semiconductor Manufacturing Company)’s 28HPC+ process technologies.

The IP set targeting ultra-low power and small footprint to enable customer with the best power and cost advantages, which includes (LP) DDR3/4 controller/PHY, ONFI 3/4 PHY, PCIe-3 PHY along with PLL, AFE, thermal sensor, VMK. front-end IP from partner includes NVMe, LDPC, security engine and ARM Ltd.Cortex-R4, etc. Furthermore, the firm also provides FPGA system emulation kit, packaging and PCB SI/PI design service for customer quick time-to-market.

SSD ASIC capabilities were proven over the course of last year when the customer released multiple SSD products manufactured on TSMC’s 28HPC+ process using firm’s SSD platform.

The ability of our innovative design services capability to overcome the challenge of integrating a customer’s design with third-party and GUC IP is the key to achieving superior time-to-market and time-to-tape-out results,” explains C.J. Liang, SVP, R&D, GUC.

The GUC SSD ASIC solution represents a one-of-a-kind service that is not available anywhere else. We successfully cooperated with third-partners on a FPGA platform build-up and SoC integration/ design/verification process. Our end-to-end approach delivers a seamless experience that results in better yield and faster time-to-market,” explained Ken Chen, president, GUC.

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