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Hybrid Memory Cube and High-Bandwidth Memory Market Worth $954 Million by 2022 – MarketsandMarkets

CAGR of 54% from 2016

According to the market research report Hybrid Memory Cube and High-Bandwidth Memory Market by Density (2GB, 4GB and 8GB), Application (Enterprise Storage, Consumer Electronics (PCS, Gaming Consoles and Laptops) and Networking and Tecommunication), & Geography – Global Forecast to 2022 (124 pages, $4,650), published by MarketsandMarkets, the market is expected to be worth $953.8 million by 2022, growing at a CAGR of 53.96% between 2016 and 2022.

The Hybrid Memory Cube and High-Bandwidth Memory market has a huge potential across all networking & telecommunication and enterprise storage applications. The major factor driving this market is the growing number of data center and networking devices across the world. The growth is also driven by the growing need for low power consumption, high scalability, and higher-bandwidth-capacity memories.

The 8GB density-based High-Bandwidth Memory market is expected to grow at the highest CAGR between 2016 and 2022. The 8GB density is expected to have high growth potential in server-based High-Bandwidth Memory applications. These are expected to replace the traditional volatile memory technologies such as GDDR5 since High-Bandwidth Memory provides higher bandwidth capacity as compared to other DRAM memories.

The market for the enterprise storage application of Hybrid Memory Cube and High-Bandwidth Memory is expected to grow at the highest rate. A highly functioning data center has several requirements such as high performance, scalability, and manageability. Hybrid Memory Cube and High-Bandwidth Memory largely solve the problem of scaling limitation and lead to cutbacks in data center and supercomputer power consumption.

North America held the largest share of the Hybrid Memory Cube and High-Bandwidth Memory market in 2015. One of the main reasons is the presence of almost all the major FPGA and graphic card providers in the U.S. For instance, leading companies in the FPGA business such as Xilinx Corporation, Altera Corporation, and Atmel Corporation and leading graphic card providers such as Advanced Micro Devices, Inc. and NVIDIA Corporation are headquartered in the U.S., which leads to the major demand for Hybrid Memory Cube and High-Bandwidth Memory in North America.

This report describes the market trends, drivers, and challenges for the Hybrid Memory Cube and High-Bandwidth Memory Market and forecasts the market up to 2022. The report also includes the value chain and Porter’s analysis of the market along with a detailed view of the market across the four major regions, namely, North America, Europe, AsiaPac, and Rest of the World (which includes the Middle East, South America, and Africa). The report profiles the 11 most promising players in the Hybrid Memory Cube and High-Bandwidth Memory market.

The companies that are profiled in the report are Samsung Electronics Co., Ltd. (South Korea), SK Hynix, Inc. (South Korea), Micron Technology, Inc. (U.S.), Intel Corporation (U.S.), Fujitsu Ltd. (Japan), IBM (U.S.), Xilinx Inc. (U.S.),  Advanced Micro Devices, Inc. (U.S.), Nvidia Corporation (U.S.), Open-Silicon, Inc. (U.S.) and Arira (U.S.).

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