Marvell BGA SSD Controllers

Marvell Semiconductor, Inc. announced the expansion of its SSD portfolio to include the 88NV1160 NVMe DRAM-less SSD controller.

It provides the performance per watt and up to 1,600MB/s read speeds.

It can be used in a single ball grid array (BGA) package SSD, as well as in a standalone controller in a 9x10mm package which makes it compatible with M.2230 and M.2242 form factors.

These features make the 88NV1160 optimized for a new generation of slim computing devices such as productivity tablets and ultrabooks.

The controller is currently available for sampling to key customers globally.

“As the world’s leading storage controller provider, Marvell has a long track record of bringing to market world-class innovations, including the pioneering integration of host memory buffer technology into DRAM-less products. Working closely with other ecosystem leaders, Marvell has continued to advance the industry and drive a new generation of low power, small form factor mobile computing systems,” said Dr. David Chen, VP of SSD business, Marvell. “The 88NV1160 controller is optimally engineered for high performance tablets and ultrabooks, providing unparalleled performance per Watt and the largest NAND compatibility on the market.“

The 88NV1160 is the latest solution in Marvell’s line of DRAM-less SSD controllers which includes its 88NV1120 SATA and 88NV1140 PCIe Gen3x1 NVMe products.

Marvell’s 88NV1160 enables PCIe Gen3x2 NVMe BGA SSD, and provides support for 2D and 3D NAND, ONFI and Toggle, MLC, TLC and QLC.

The 88NV1160 facilitates BGA SSD support for both 16x20mm and 11.5x13mm form factors.

Key features of 88NV1160 include:

NVMe support over PCIe Gen3x2
Hardware automated NVMe 1.3 support with Host Memory Buffer support
Low power management (L1.2) design
Dual core ARM Cortex-R5 CPUs
Embedded SRAM with hardware accelerators to optimize IO/s performance
ONFI3 and Toggle2 NAND support
NANDEdge LDPC error-correction technology boosts SSD endurance and reliability and supports 15nm 2D TLC and 3D TLC/QLC
Firmware and manufacturing support compatible with mainstream NAND
28nm low power CMOS process