Computex: Phison PS8226 3D NAND eMMC 5.1 Controller for Mobile Phone Market

Phison Electronics Corporation, Inc. announced its PS8226 eMMC controller at 2017 Computex Taipei, Taiwan.

This eMMC 5.1 compliant controller aims to support the 3D TLC technology from multiple NAND memory companies.

The second half of 2017 will see a strong demand for mobile devices. Driven by the increasing performance and capacity requirements from high-resolution video and streaming applications, various smartphone manufacturers plan on introducing an array of new products in the next quarters, and the eMMC and eMCP storage devices are in high demand. The company is optimistic that the PS8226 with 3D NAND solutions will capture a significant share in the mobile storage market.

The expansion of the mobile market saw firm’s eMMC/eMCP controller solutions benefiting from tier-1 smartphone brands design-wins through strategic NAND and module partners. PS8226 is set to continue this trend. Currently, the 2D to 3D NAND transition is driven by all memory manufacturers, and the PS8226 will contribute as the first independent eMMC controller taking advantage of 3D TLC’s high density and performance. The momentum of PS8226 solutions will also pave the way for the next generation UFS (Universal Flash Storage) adopting 3D TLC NAND.

In order to deliver the best endurance out of the emerging 3D NAND, PS8226 is equipped with the company’s proprietary StrongECC correction engine. Utilizing an optimized power domain management scheme and hardware architecture, the power consumption of PS8226 has reduced by 50% while the random performances have doubled compared to the 2D NAND eMMC solutions. The design of the PS8226 effectively removes the need for additional passive components in the eMMC package, enabling significant overall BOM savings. These advantages of PS8226 will help customers accomplish performance, robust, power-efficient and cost-competitive 3D eMMC/eMCP mobile solutions.

PS8226 highlights:

eMMC 5.1 compliant with Command Queue support
Supports latest 3D MLC and TLC, up to 8 NAND CE, capacity up to 256GB
Proprietary StrongECC guarantees the 3D TLC reliability: Compared to a traditional BCH ECC engine, the StrongECC improves 30% in decoding capability and saves 70% more power
3D TLC sequential performance: Up to 310MB/s read and 220MB/s write
3D TLC random performance: Up to 22,000 IO/s read and 29,000 IO/s write