ATP Electronics Shows 3D NAND SSD Product Line192GB to 2TB in 2.5-inch, mSATA, SlimSATA and M.2 form factors
This is a Press Release edited by StorageNewsletter.com on 2017.03.17
ATP Electronics Inc. reveals its 3D NAND based SATA product line up on the Embedded World 2017 in Nuremberg, Germany.
The products have gone through stringent chip as well as module level validation tests and will be manufactured using company's in-house self-packaging technology. Available form factors include 2.5", mSATA, SlimSATA and M.2 in various capacities, including intermediate densities such as 192, 384 and 768GB.
Higher memory capacity
By stacking more layers vertically, greater capacities, such as one, 1.5 and 2TB, are made possible through 3D NAND.
Lower cost per bit
Compared to planar NAND, 3D NAND shows greater cost advantage as the capacity increases.
Increased longevity and supply flexibility through company's die packaging
Our high end manufacturing facility is capable of processing NAND wafer dies into the firm's own SDP, DDP, QDP or ODP BGA packages. This simplifies supply chain planning and results in flexibility and better lead times. At the same time, it allows us to offer better longevity for products through extended wafer supply agreements with manufacturers.