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Rambus Has Signed Patent License Agreement With Western Digital

Covers use of patented memory technologies through 2021.

Rambus Inc. signed a broad patent license agreement with Western Digital Corporation.

The agreement covers the use of Rambus patented memory technologies, including high-speed interfaces, memory architectures, resistive memory and security technologies, in Western Digital products through 2021. The agreement also includes an additional 5-year extension option.

Specific terms of the agreement were not disclosed.

With the enormous amount of information flowing through today’s data center applications, memory and interface technologies play a critical role to meet the increasing demands of higher bandwidth and lower latency needs,” said Luc Seraphin, SVP and GM of the memory and interfaces division, Rambus. “The lines between non-volatile memory and DRAM have blurred as the increasing performance of traditional NAND flash has driven the adoption of faster interface architectures. This agreement with Western Digital provides access to our patented memory technologies that address the challenging requirements of modern data centers.

Rambus develops low-power memory and SerDes interface chips and IP cores to meet the needs of increasingly diverse enterprise and mobile applications. It also drives innovations in silicon-to-cloud security, making digital products safer and better.

The Rambus memory and interfaces division develops products and services that solve the power, performance, and capacity challenges of the communications and data center computing markets. Rambus-enhanced standards-compatible and custom memory and serial link solutions include chips, architectures, memory and SerDes interfaces, IP validation tools, and system and IC design services. Developed through system-aware design methodology, the products deliver improved time-to-market and quality.

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