Datadobi

ATP Electronics Displays Wafer Packaged NAND Flash Storage Solutions

Including industrial temperature MLC and SLC memory cards, and embedded 3D NAND SSDs.
This is a Press Release edited by StorageNewsletter.com on 2016.11.25

AddThis Social Bookmark Button

ATP Electronics Inc. displays a complete product line of its next generation storage solutions designed, manufactured, and tested from NAND wafer to finished SSD.

ATP_20160808_140438
These product line displays include industrial temperature MLC and SLC memory cards, and embedded SSDs utilizing 3D NAND flash. The company showcased these solutions and related products from November 16 to 18 at Embedded Technology 2016 in Yokohama, Japan.

3D MLC/TLC NAND is primarily characterized for usage in big market SSD usage models in client and enterprise applications. 3D NAND utilization in embedded, industrial applications must be characterized for many other conditions including data retention over temperature variance, cross temperature reliability, and read-only boot usage models among others. To be at the forefront of this technology shift, the firm has taken the initiative with major resource investment into characterization of 3D NAND in such conditions.

Articles_bottom